Huawei and Mapua ink scholarship agreement

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Huawei and Mapua ink scholarship agreement

Huawei Technologies Phils., Inc. announced its scholarship agreement with Mapúa University via a virtual launch ceremony. The pilot scholarship grant will cover full tuition that will benefit 3rd year to 5th year engineering students majoring in Electronics Engineering, Computer Science, Information Technology, and Computer Engineering.

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In attendance from Mapúa were: Dr. Reynaldo B. Vea, President and CEO; Dr. Dionisia Lanuza, Dean for Admissions and Scholarships; Engr. Ariel Kelly Balan, Dean, School of Information Technology; and Engr. Alejandro Ballado, Dean, School of Electrical, Electronics and Computer Engineering.

“I would like to thank Huawei for the generous offer of scholarship for Mapúa students, especially at this time when most people may be suffering some hardships because of the current situation. Scholarships are important for the continuity of learning of Mapúa students,” stated Dr. Reynaldo B. Vea.

Ms. Jade Cao, Huawei HR Director, stated, “Huawei’s mission is to expand the benefits of technology for everyone, everywhere, which is exemplified in our vision to bring digital to every person, home, and organization for a fully connected and intelligent world. We know that education is a key component in bridging this digital divide. By providing opportunities for intelligent and deserving students to finish their college education, we hope to help the Philippines build its local talent ecosystem and contribute to the continued growth of the Philippine economy.”

Mapúa has been a longstanding partner of Huawei, having delivered the storage course as part of the Huawei ICT Academy. In the past, graduating Mapúans also interned at Huawei, and Huawei participated in the university’s career fairs.

Interested students may contact the Mapúa Scholarship Office 8247-5000 loc. 2300, 0915 830 9340, or 0905 112 8157 for questions or inquires. Students may apply throughout December and avail of the scholarship as early as the following term.

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